Nerve-Stimulating And Signal-Monitoring Device And Method Of Manufacturing The Same And Nerve-Stimulating And Signal-Monitoring System

ABSTRACT

A nerve-stimulating and signal-monitoring device includes a flexible substrate, a modulation/demodulation module, a SOC unit and a plurality of stimulation probes. The modulation/demodulation module demodulates coded nerve-stimulating radio-frequency signals or modulates sending coded epidermal nerve response signals. The SOC unit and the modulation/demodulation module can be integrally packaged and bonded on the flexible substrate. The SOC unit decodes and transforms the coded nerve-stimulating radio-frequency signals to obtain nerve-stimulating electrical probe-driving signals. The stimulation probes protrude from the flexible substrate, are configured to transmit the nerve-stimulating electrical probe-driving signals to epidermal nerves, and are electrically coupled to the SOC unit. The SOC unit can receive, amplify, analyze, classify and encode epidermal nerve response signals sent to the modulation/demodulation module for modulating, and such coded epidermal nerve response signals are subsequently transmitted by an antenna to the monitor station for decoding, monitoring and analysis.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a nerve-stimulating andsignal-monitoring device and system, and relates more particularly to anerve-stimulating and signal-monitoring device using radio frequencyidentification technology for communication and built on a flexiblesubstrate, and a system including the same.

2. Description of the Related Art

Traditionally, an array of probes for stimulating nerves and monitoringresponsive signals are formed by using a hard silicon substrate. Such anarray of probes is heavy and fragile, must be manufactured with hightemperature processes, and has a high manufacturing cost. Moreover, thearray of traditional probes cannot be suitably designed in accordancewith and neatly engage the contour of the body of a subject, andtherefore the probes and the body of the subject cannot be properlyengaged.

In addition, the array of traditional probes manufactured by using ahard silicon wafer requires an additional device that is used toincrease the signal to noise ratios of retrieved signals and establishesimpedance matching. Therefore, the building of the array of traditionalprobes is costly and highly complex.

Further, the array of traditional probes can be integrated with a thinfilm transistor amplifier to increase the signal to noise ratio and toimprove impedance matching characteristics thereof. However, extraprocesses are required to manufacture the thin film transistoramplifier, increasing the cost and difficulty of manufacturing.

The technology of traditional arrayed probes cannot provide an array ofprobes that can be simply and cheaply manufactured, that can be suitablydesigned in accordance with and neatly engage the contour of the body ofa subject, and that can increase the signal to noise ratio and improveimpedance matching characteristics thereof. Therefore, a new array ofprobes is required to be developed.

SUMMARY OF THE INVENTION

The present invention provides a nerve-stimulating and signal-monitoringdevice and system. Radio transmission technology and a printed circuitboard manufacturing process are utilized to manufacture a newnerve-stimulating and signal-monitoring device, which can be massproduced, is cheap, can be laid on a subject's body according to itsoutline profile, can increase signal to noise ratio, and can eliminateimpedance matching problem.

One embodiment of the present invention provides a nerve-stimulating andsignal-monitoring device, which comprises a flexible substrate, amodulation/demodulation module, a system on chip (SOC) unit, an antenna,and a plurality of stimulation probes. The modulation/demodulationmodule is disposed on the flexible substrate and configured todemodulate a nerve-stimulating coded radio-frequency signal or tomodulate a coded epidermal nerve response signal from the SOC unit. Theantenna is formed on the flexible substrate, coupled to themodulation/demodulation module. The SOC unit is coupled to themodulation/demodulation module, wherein the SOC unit decodes andtransforms the coded nerve-stimulating radio-frequency signal to obtaina nerve-stimulating electrical probe-driving signal, and/or the SOC unitreceives, amplifies, analyzes, classifies and encodes an epidermal nerveresponse signal, which is then sent to the modulation/demodulationmodule for modulating and is subsequently transmitted by the antenna tothe monitor station for decoding, monitoring and analysis. The pluralityof stimulation probes, protruding from the flexible substrate andelectrically coupled to the SOC unit, are configured to transmit thenerve-stimulating electrical probe-driving signal and/or the epidermalnerve response signal. By the way the above nerve-stimulating andmonitoring actions can be applied to a plurality of epidermal nerves oneby one in a sequential manner.

In one embodiment, the SOC unit and the modulation/demodulation moduleare packaged on the flexible substrate by using a system in package(SIP) technology.

One embodiment of the present invention proposes a nerve-stimulating andsignal-monitoring system, which comprises the above-mentionednerve-stimulating and signal-monitoring device, a receiving/transmittingdevice, and a monitor station. The receiving/transmitting device isconfigured to receive the coded epidermal nerve response signal and totransmit the nerve-stimulating coded radio-frequency signal by theantenna to the nerve-stimulating and signal-monitoring device. Themonitor station is coupled to the receiving/transmitting device andconfigured to provide the nerve-stimulating a code signal for generatingthe coded nerve-stimulating radio-frequency signal and to receive thecoded epidermal nerve response signal for decoding, monitoring andanalysis.

In one embodiment, the SOC unit can acquire nerve response signals fromepidermal nerves through the stimulation probes, and then can amplify,analyze, classify, and encode the nerve response signals, which arethereafter modulated by the modulation/demodulation module, and thentransmitted through the antenna to the receiving/transmitting device andfinally forwarded to the monitor main station for decoding, analysis andmonitoring of the response of the epidermal nerves. The SOC unit can bean embedded SOC unit.

The present invention provides a method for manufacturing anerve-stimulating and signal-monitoring device, which comprises thesteps of: forming a first silicon oxide layer on a surface of a flexiblesubstrate; forming a patterned doped p-type poly-silicon layer on thefirst silicon oxide layer, wherein the patterned doped p-typepoly-silicon layer comprises a plurality of contact pads; forming asecond silicon oxide layer on the patterned doped p-type poly-siliconlayer; forming a circuit layer on the second silicon oxide layer,wherein the circuit layer comprises an antenna, a plurality of chippads, and at least one probe pad coupled to the plurality of chip pads;forming a plurality of openings on the second silicon oxide layer forexposing the plurality of contact pads on the patterned doped p-typepoly-silicon layer; forming a gold layer on the circuit layer and on theplurality of contact pads on the patterned doped p-type poly-siliconlayer so as to connect the circuit layer to the plurality of contactpads; attaching a chip to the plurality of chip pads of the circuitlayer by using a flip-chip bonding technology, wherein the antenna iselectrically coupled to the chip; forming a plurality of through holeson the at least one probe pad; and securely and correspondinglyattaching a plurality of stimulation probes into the plurality ofthrough holes.

To better understand the above-described objectives, characteristics andadvantages of the present invention, embodiments, with reference to thedrawings, are provided for detailed explanations.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be described according to the appended drawings inwhich:

FIG. 1 is a schematic view showing a nerve-stimulating andsignal-monitoring system according to one embodiment of the presentinvention;

FIG. 2 is a schematic view showing a nerve-stimulating andsignal-monitoring device according to one embodiment of the presentinvention;

FIG. 3 is a cross-sectional view along line A-A′ of FIG. 2;

FIG. 4 is a cross-sectional view showing multiple thin films formed on aflexible substrate according to one embodiment of the present invention;

FIG. 5 is a cross-sectional view showing a patterned doped p-typepoly-silicon layer according to one embodiment of the present invention;

FIG. 6 is a cross-sectional view showing a doped p-type poly-siliconlayer and a gold layer formed on the doped p-type poly-silicon layeraccording to one embodiment of the present invention;

FIG. 7A is a front view showing a circuitry layout on a flexiblesubstrate after a chrome layer and a nickel layer are formed accordingto one embodiment of the present invention;

FIG. 7B is a cross-sectional view along line B-B′ of FIG. 7A;

FIG. 8A is a front view showing a circuitry layout on a flexiblesubstrate after a gold layer is formed according to one embodiment ofthe present invention;

FIG. 8B is a cross-sectional view along line C-C′ of FIG. 8A;

FIG. 9A is a front view showing a circuitry layout on a flexiblesubstrate after a plurality of through holes are formed and a chip isflip-chip bonded according to one embodiment of the present invention;

FIG. 9B is a cross-sectional view along line D-D′ of FIG. 9A;

FIG. 9C is a view showing a probe insertion tool according to oneembodiment of the present invention;

FIG. 10 shows a stimulation probe according to one embodiment of thepresent invention; and

FIG. 11 shows a capacitor having a doped p-type poly-silicon electrodeaccording to one embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1 is a schematic view showing a nerve-stimulating andsignal-monitoring system 100 according to one embodiment of the presentinvention. The nerve-stimulating and signal-monitoring system 100comprises a nerve-stimulating and signal-monitoring device 102, areceiving/transmitting device 104, and a monitor station 106. Thenerve-stimulating and signal-monitoring device 102 comprises an antenna118, a modulation/demodulation module 120, a rectifier module 110, aresistor-capacitor circuit 112, a system on chip (SOC) unit 114, and aplurality of stimulation probes 116, wherein the nerve-stimulating andsignal-monitoring device 102 is formed on a flexible substrate. In oneembodiment, the modulation/demodulation module 120, the rectifier module110, and the SOC unit 114 can be integrated in a chip 108. The antenna118 can be formed on the flexible substrate. The modulation/demodulationmodule 120 can be disposed on the flexible substrate, configured todemodulate a coded nerve-stimulating received radio-frequency signalfrom the receiving/transmitting device 104 and to modulate a codedepidermal nerve response signal relating to an epidermal nerve responsesignal from an epidermal nerve, which is transmitted to thereceiving/transmitting device 104. The modulation process is performedby modulating the coded epidermal nerve response signal on a radiocarrier wave so as to transmit the coded epidermal nerve response signalvia radio communication links.

The rectifier module 110, electrically connected to the antenna 118, isconfigured to produce direct current voltage by using a receivedradio-frequency signal received by the antenna 118. When thenerve-stimulating and signal-monitoring device 102 is in a passive mode,the nerve-stimulating and signal-monitoring device 102 is driven by thedirect current voltage. Generally, to limit the power consumption of thenerve-stimulating and signal-monitoring device 102, the operation modeof the nerve-stimulating and signal-monitoring device 102 is switched toa passive mode from an active mode when the nerve-stimulating andsignal-monitoring device 102 is idle, and the nerve-stimulating andsignal-monitoring device 102 is activated and operated when receiving acoded nerve-stimulating radio-frequency signal from thereceiving/transmitting device 104. Only when a coded nerve-stimulatingradio-frequency signal is weak and a coded epidermal nerve responsesignal is to be sent to the receiving/transmitting device 104, is thenerve-stimulating and signal-monitoring device 102 switched to activemode. Otherwise, a coded epidermal nerve response signal is sent to thereceiving/transmitting device 104 in the passive mode.

The SOC unit 114 is separately coupled to the modulation/demodulationmodule 120, the rectifier module 110, the resistor-capacitor circuit112, and the plurality of stimulation probes 116. The SOC unit 114 canbe driven by the current or the voltage from the rectifier module 110 sothat it can operate in the passive mode. The resistor-capacitor circuit112 can also be formed on the flexible substrate and be configured toprovide the SOC unit 114 with a clock signal for driving the SOC unit114. The SOC unit 114 receives and decodes a coded nerve-stimulatingsignal from the modulation/demodulation module 120, and obtains andsends a nerve-stimulating electrical probe-driving signal out. The SOCunit 114 transmits the nerve-stimulating electrical probe-driving signalto the stimulation probes 116 via conductive traces 122 such that theepidermal nerves can be stimulated or treated. In the presentembodiment, the SOC unit 114 is electrically connected to themodulation/demodulation module 120 so that it can directly decode thecoded radio-frequency signal received by the antenna 118. In addition,the above nerve-stimulating and monitoring actions can be applied to aplurality of epidermal nerves one by one in a sequential manner.

In addition, the SOC unit 114 can acquire nerve response signals fromepidermal nerves through the stimulation probes 116, thereby monitoringthe response of the stimulated or treated epidermal nerves. The nerveresponse signals acquired by the SOC unit 114 are amplified, analyzed,classified, and encoded, and are then transmitted to themodulation/demodulation module 120. The modulation/demodulation module120 modulates the coded epidermal nerve response signal with a radiocarrier wave to become radio transmission waves. The radio transmissionwaves are then transmitted, and are received by thereceiving/transmitting device 104.

In the present embodiment, the SOC unit 114 can acquire nerve responsesignals from epidermal nerves through the stimulation probes 116, andthen amplify, analyze, classify, and encode the nerve response signals,which are thereafter modulated by the modulation/demodulation module120, and are transmitted through the antenna 118 to the main station 106for analysis and monitoring the response of the epidermal nerves.

The receiving/transmitting device 104, configured to transmit/receive acoded nerve-stimulating radio-frequency signal/coded epidermal nerveresponse signal, comprises an antenna 124 and a receiving/transmittingmodule 126 electrically connected to the monitor station 106 andconfigured to modulate coded nerve-stimulating radio-frequency signalsand to demodulate epidermal nerve response signals. When the monitorstation 106 provides nerve-stimulating electrical probe-driving signalsto the stimulation probes 116, the coded nerve-stimulating signals aremodulated by the receiving/transmitting module 126 so that they can betransmitted through the antenna 124 to the nerve-stimulating andsignal-monitoring device 102. The receiving/transmitting module 126demodulates the coded epidermal nerve response signals, which are thentransmitted to the monitor station 106 for decoding, analyzing,monitoring, and determining the response and the effectiveness oftreatment induced by the nerve-stimulating electrical probe-drivingsignals. In one embodiment, the monitor station 106 comprises codesprovided for the nerve-stimulating signals.

FIG. 2 is a schematic view showing a nerve-stimulating andsignal-monitoring device 102 according to one embodiment of the presentinvention. Referring to FIGS. 2 and 3, the nerve-stimulating andsignal-monitoring device 102, formed on a flexible substrate 202,comprises a flexible substrate 202, a circuit layer 206 formed on asurface 204 of the flexible substrate 202, a chip 108 that is flip-chipbonded to the circuit layer 206, a plurality of groups 212 ofstimulation probes electrically connected to the circuit layer 206, anda battery 210 configured as an electrical source when thenerve-stimulating and signal-monitoring device 102 operates in an activemode. On the flexible substrate 202, a plurality of resistors 214 andcapacitors 216 formed of doped p-type poly-silicon can be formed. Theelectrodes of the resistors 214 and capacitors 216, the circuit layer206, and the dielectric layer between the electrodes and the circuitlayer 206 are constituted as thin film passive devices involved in theoperation of the nerve-stimulating and signal-monitoring device 102. Thecircuit layer 206 may comprise an antenna 118 disposed on two oppositesides of the chip 108 and coupled thereto.

In the present embodiment, the chip 108 can be a radio frequencyidentification (RFID) chip, which can be constructed by integrating therectifier module 110, the SOC unit 114, and the modulation/demodulationmodule 120 by using a system in package (SIP) technology. The antenna118 and the plurality of stimulation probes 116 are formed on theflexible substrate 202 with a chip 108 connected thereto so as tostimulate and monitor biological nerves using a radio transmission link.Referring to FIG. 2, the nerve-stimulating and signal-monitoring device102 of the present invention may further include a plurality of holes446 disposed adjacent to four corners of the flexible substrate 202 andallowing a rope to pass through them for retention. Such an arrangementallows the nerve-stimulating and signal-monitoring device 102 to beportable and conveniently used.

FIGS. 4 to 9B are schematic views showing a method for manufacturing anerve-stimulating and signal-monitoring device according to oneembodiment of the present invention. As shown in FIG. 4, a layer ofsilicon oxide 402 with thickness of 10 to 20 micrometers is evaporatedon the back of a flexible substrate 202 as an isolation and wafer-prooflayer for an array of stimulation probes, an antenna, and resistors andcapacitors. Next, a positive photoresist layer 404 with thickness of0.5-5 micrometers is formed and baked for drying. The photoresist layer404 can protect the silicon oxide 402 and serve as a waterproof layer.On the front side of the flexible substrate 202, a silicon oxide layer406 with thickness of 1-10 micrometers is deposited by using anevaporation process. Thereafter, a mixed powder of p-type impurity andsilicon is deposited on the silicon oxide layer 406 by using an e-gunevaporation process to form a doped p-type amorphous silicon layer withthickness in a range of from 10 to 250 micrometers. Next, a laser isused to anneal the p-type amorphous silicon layer to obtain a dopedp-type poly-silicon layer 408, which can be used as a base structure ofthe electrodes of resistors and capacitors. Finally, a negativephotoresist layer 410 with thickness of 0.5-5 micrometers is formed onthe p-type poly-silicon layer 408 and baked for drying.

Referring to FIGS. 4 and 5, a first photomask and a lithographic processare used to define a negative photoresist layer 410 formed on the frontside of the flexible substrate 202 for protection of the doped p-typepoly-silicon resistor and capacitor structure. The photoresist layer 410is exposed to ultraviolet light to form long chain polymer componentstherein. After developing, the unexposed portions of the photoresistlayer 410 are removed. Next, the portions of the doped p-typepoly-silicon layer 408 not protected by the photoresist layer 410 areetched away by using KOH solution. Thereafter, the protectivephotoresist layer 410 is removed by acetone or using an ozone ashingprocess so that a resistor 214 can be formed.

Referring to FIG. 6, a silicon oxide layer 414 with thickness of 1-10micrometers is deposited on the patterned doped p-type poly-siliconlayer 412 as an insulating layer. Next, two metal layers, a chrome layer416 and a nickel layer 418, are sequentially formed for fabricating anantenna, metal resistors, stimulation probes, and conductive traces forconnecting a voltage source and transmitting signals. Thereafter, alayer of negative photoresist 420 with thickness of 0.5-5 micrometers iscoated on the two metal layers and is baked for drying.

Referring to FIGS. 6, 7A, and 7B, a second photomask and a lithographicprocess are used to define areas including long chain polymercomponents, which are formed after the negative photoresist 420 isexposed to ultraviolet light. The areas are configured to protect theportions used to form the resistor 422, the antenna 118, the probe pads424, and electrical traces 426 for connecting a voltage source andtransmitting signals. After a developing process, the undefined portionsof the photoresist layer 420 are removed. Next, a solution for etchingchrome and nickel is used to remove the portion of the chrome layer 416and the nickel layer 418, which is not protected by the photoresistlayer 420. The remaining metal forms the circuit layer 206, whichincludes the resistor 422, the antenna 118, the probe pads 424, and theelectrical traces 426 for connecting a voltage source and transmittingsignals. Finally, the photoresist layer 420 is removed by acetone or anozone ashing process.

In another embodiment, the circuit layer 206 can be manufactured using amethod in which a thick photoresist such as SU-8 is defined, and theportions of the photoresist such as SU-8 where the resistor 422, theantenna 118, the probe pads 424, and the electrical traces 426 arelocated are removed. Next, chrome and nickel are deposited. Finally, thephotoresist such as SU-8 is removed by using a lift-off process, and thestructures of the circuit layer 206 are left.

As shown in FIGS. 7A, 8A, and 8B, a negative photoresist layer withthickness of 0.5-5 micrometers is coated and then baked for drying.Using the third photomask and a lithographic process, the portions ofthe contact pads 428 of the resistor 214 for external connection, theantenna 118, the probe pads 424, and the electrical traces 426 forconnecting to a voltage source and transmitting signals are defined onthe negative photoresist as shown in FIG. 7A. After performing adeveloping process and etching away the chrome, nickel, and siliconoxide covering the contact pads 428 of the poly-silicon resistor 214, agold layer 443 with thickness of 0.02 to 0.5 micrometers is formed onthe chrome and nickel films on the contact pads 428, the solder pads 430connected to the contact pads 428 via the electrical traces 426, theantenna 118, the probe pads 424, and the electrical traces 426 forconnecting to a voltage source and transmitting signals. The three metallayer structure including chrome, nickel, and gold layers has betterelectrical conductivity, compared to the traditional film made of silverpaste by using screen printing or inject printing technique.

Referring to FIGS. 8A, 9A, and 9B, metal bumps are respectively formedon chip pads 432 and antenna feeding ends 434 as shown in FIG. 8A. Next,a chip 108 is flip-chip bonded to the chip pads 432 for connecting to avoltage source and transmitting signals and the antenna feeding ends 434by using a thermal compression welding technique such that the chip 108is welded on the flexible substrate 202. Thereafter, using a drill, aplurality of suitably sized through holes 436 are formed on each probepad 424 and can be arranged in a desired manner as shown in FIGS. 9A and9B. Finally, the plurality of stimulation probes 116 are respectivelyinserted into the through holes 436. Before the insertion of thestimulation probes 116 into the through holes 436, a probe insertiontool 445 is placed below and aligned with the flexible substrate 202. Onthe probe insertion tool 445, a plurality of cavities, as shown in FIG.9C, are formed at locations corresponding to the probe pads 424. Afterthe stimulation probes 116 are inserted through the guiding holes 436 onthe flexible substrate 202, the tips of the stimulation probes 116 mayengage the bottoms of the cavities. Next, a plier or a punching machineis used to neatly trim the exposed portions of the inserted stimulationprobes 116, wherein a predetermined length of each stimulation probe 116is left to protrude beyond the corresponding probe pad 424 for therequirement of the next screen printing or inject printing process.Finally, a conductive paste, for example a silver paste, is applied oneach probe pad 424 and the respective stimulation probes 116 by using ascreen printing or inject printing technique for electrical connection.

Referring to FIG. 10, before insertion of the stimulation probes 116,the tip of each stimulation probe 116 can be shaped to have a tip angleθ in a range of from 35 to 55 degrees for piercing the epidermis anddermis during treatment using a plier or a punching machine. Preferably,the tip angle θ can be 45 degrees. The material of the stimulation probe116 can be stainless steel, tungsten or nickel chrome wire, and thestimulation probe 116 can be coated with titanium nitride or titanium.

Referring to FIG. 11, the capacitor 216 as shown in FIG. 2 can befabricated by using the above-mentioned processes. Doped p-typepoly-silicon can be used to make the lower electrode 437. The chrome,nickel, and gold layers can be used as the upper electrode 438. The goldconductive traces 440 can be used for externally connecting the lowerelectrode 437 and for externally connecting the upper electrode 438,wherein silicon oxide layer 442 or other dielectric material layer isformed between the lower and upper electrodes 437 and 438. The capacitor216 can be coupled to the antenna 118 to adjust the resonant frequencyof the antenna 118. The capacitor 216 can also be applied in theresistor-capacitor circuit 112 as shown in FIG. 1, or used for powersupplies or for filtering signals.

In summary, the present invention proposes a nerve-stimulating andsignal-monitoring device and a system using the same. The system usesthe RFID technology for communication, and the device includes aflexible substrate, an antenna formed on the substrate by using aprinted circuit board manufacturing process, and an array of stimulationprobes attached to the flexible substrate. The flexible substrate isintegrally disposed with an RFID chip so that the device can providestimulation signals and monitor the response of stimulation throughradio transmission. The technology of the present invention can supportremote control of the RFID chip, and sending of different stimulationsignals. The response signals acquired by the stimulation probes can beamplified by the amplifier (for example, an instrumentation amplifier)in the SOC unit so as to increase the signal to noise ratio and toeliminate the impedance matching problem. The instrumentation amplifierneeds a plurality of externally connected resistors, which can bemanufactured on the flexible substrate by using the processes used tomanufacture the aforementioned resistor 214 or 422. The externallydisposed resistors can reduce the area occupied by the SOC unit, andalso resolve the heat dissipation issue that a SOC unit havinginternally disposed resistors might have. In addition, the flexiblesubstrate allows the stimulation probes to be neatly placed inaccordance with the outline contour of a subject's body such that theeffective contact can be improved.

The above-described embodiments of the present invention are intended tobe illustrative only. Numerous alternative embodiments may be devised bypersons skilled in the art without departing from the scope of thefollowing claims.

1. A nerve-stimulating and signal-monitoring device, wirelessly coupledto a monitor station, the nerve-stimulating and signal-monitoring devicecomprising: a flexible substrate; a modulation/demodulation moduledisposed on the flexible substrate, configured to demodulate a codednerve-stimulating radio-frequency signal or to modulate a codedepidermal nerve response signal; an antenna formed on the flexiblesubstrate, coupled to the modulation/demodulation module; a system onchip (SOC) unit coupled to the modulation/demodulation module, whereinthe SOC unit decodes and transforms the nerve-stimulating coded signalto obtain a nerve-stimulating electrical probe-driving signal, and/orthe SOC unit receives, amplifies, analyzes, classifies and encodes aepidermal nerve response signal, which is then sent to themodulation/demodulation module for modulating and is subsequentlytransmitted using the antenna to the monitor station for monitoring andanalysis; and a plurality of stimulation probes protruding from theflexible substrate and electrically coupled to the SOC unit, configuredto transmit the nerve-stimulating electrical probe-driving signal and/orthe epidermal nerve response signal.
 2. The nerve-stimulating andsignal-monitoring device of claim 1, further comprising a thin filmcapacitor configured to adjust a resonant frequency of the antenna,wherein the thin film capacitor is formed on the flexible substrate andis coupled to the antenna.
 3. The nerve-stimulating andsignal-monitoring device of claim 2, wherein the thin film capacitorcomprises a lower electrode of doped p-type poly-silicon, an upperelectrode, and a dielectric layer disposed between the lower electrodeand the upper electrode.
 4. The nerve-stimulating and signal-monitoringdevice of claim 3, further comprising a rectifier module electricallycoupled to the antenna, wherein the rectifier module is configured toproduce direct current voltage by using the coded nerve-stimulatingradio-frequency signal.
 5. The nerve-stimulating and signal-monitoringdevice of claim 1, further comprising a resistor-capacitor circuitformed on the flexible substrate and coupled to the SOC unit, configuredto provide the SOC unit with a clock signal, wherein theresistor-capacitor circuit comprises at least one first thin filmresistor and at least one thin film capacitor.
 6. The nerve-stimulatingand signal-monitoring device of claim 5, wherein the resistor-capacitorcircuit further comprises a plurality of second thin film resistors, andthe SOC unit further comprises an amplifier connected to the pluralityof second thin film resistors.
 7. The nerve-stimulating andsignal-monitoring device of claim 6, wherein the thin film capacitorcomprises a lower electrode of doped p-type poly-silicon, an upperelectrode, and a dielectric layer disposed between the lower electrodeand the upper electrode, and the thin film resistors are made of dopedp-type poly-silicon.
 8. The nerve-stimulating and signal-monitoringdevice of claim 6, wherein the amplifier is an instrumentationamplifier.
 9. The nerve-stimulating and signal-monitoring device ofclaim 1, wherein the stimulation probe is made of stainless steel,tungsten or nickel chrome wire, and the stimulation probe is coated withtitanium nitride or titanium.
 10. The nerve-stimulating andsignal-monitoring device of claim 9, wherein a tip angle of thestimulation probe is in a range of from 35 to 55 degrees.
 11. Anerve-stimulating and signal-monitoring system, comprising: anerve-stimulating and signal-monitoring device, comprising: a flexiblesubstrate; a modulation/demodulation module disposed on the flexiblesubstrate, configured to demodulate a coded nerve-stimulatingradio-frequency signal or to modulate a coded epidermal nerve responsesignal; an antenna formed on the flexible substrate, coupled to themodulation/demodulation module; a system on chip (SOC) unit coupled tothe modulation/demodulation module, wherein the SOC unit decodes andtransforms coded nerve-stimulating radio-frequency signal to obtain anerve-stimulating electrical probe-driving signal, and/or the SOC unitreceives, amplifies, analyzes, classifies and encodes a epidermal nerveresponse signal, which is then sent to the modulation/demodulationmodule for modulating and is subsequently transmitted by using theantenna to the monitor station for monitoring and analysis; and aplurality of stimulation probes protruding from the flexible substrateand electrically coupled to the SOC unit, configured to transmit thenerve-stimulating electrical probe-driving signal and/or the epidermalnerve response signal; a receiving/transmitting device configured toreceive the coded epidermal nerve response signal and to transmit thenerve-stimulating coded radio-frequency signal by the antenna to thenerve-stimulating and signal-monitoring device; and a monitor stationcoupled to the receiving/transmitting device, configured to provide acode signal for generating the coded nerve-stimulating radio-frequencysignal.
 12. The nerve-stimulating and signal-monitoring system of claim11, wherein the SOC unit is configured to receive, amplify, analyze,classify and encode the epidermal nerve response signal from anepidermal nerve to obtain the coded epidermal nerve response signal,which is transmitted by the modulation/demodulation module and isreceived by the monitor station and is decoded for monitoring andanalysis.
 13. The nerve-stimulating and signal-monitoring system ofclaim 12, wherein the nerve-stimulating and signal-monitoring devicefurther comprises a thin film capacitor configured to adjust a resonantfrequency of the antenna, wherein the thin film capacitor is formed onthe flexible substrate and is coupled to the antenna, wherein the thinfilm capacitor comprises a lower electrode of doped p-type poly-silicon,an upper electrode, and a dielectric layer disposed between the lowerelectrode and the upper electrode.
 14. The nerve-stimulating andsignal-monitoring system of claim 11, wherein the nerve-stimulating andsignal-monitoring device further comprises a rectifier moduleelectrically coupled to the antenna, wherein the rectifier module isconfigured to produce direct current voltage by using the received codednerve-stimulating radio-frequency signal.
 15. The nerve-stimulating andsignal-monitoring system of claim 14, wherein themodulation/demodulation module, the SOC unit, and the rectifier moduleare integrated in a chip.
 16. The nerve-stimulating andsignal-monitoring system of claim 11, wherein the nerve-stimulating andsignal-monitoring device further comprises a resistor-capacitor circuitformed on the flexible substrate and coupled to the SOC unit, configuredto provide the SOC unit with a clock signal, wherein theresistor-capacitor circuit comprises at least one first thin filmresistor and at least one thin film capacitor; wherein the thin filmcapacitor comprises a lower electrode of doped p-type poly-silicon, anupper electrode, and a dielectric layer disposed between the lowerelectrode and the upper electrode, and the thin film resistor is made ofdoped p-type poly-silicon.
 17. The nerve-stimulating andsignal-monitoring system of claim 11, wherein the stimulation probe ismade of stainless steel, tungsten or nickel chrome wire, and thestimulation probe is coated with titanium nitride or titanium, and a tipangle of the stimulation probe is in a range of from 35 to 55 degrees.18. A method for manufacturing a nerve-stimulating and signal-monitoringdevice, comprising steps of: forming a first silicon oxide layer on asurface of a flexible substrate; forming a patterned doped p-typepoly-silicon layer on the first silicon oxide layer, wherein thepatterned doped p-type poly-silicon layer comprises a plurality ofcontact pads; forming a second silicon oxide layer on the patterneddoped p-type poly-silicon layer; forming a circuit layer on the secondsilicon oxide layer, wherein the circuit layer comprises an antenna, aplurality of chip pads, and at least one probe pad coupled to theplurality of chip pads; forming a plurality of openings on the secondsilicon oxide layer for exposing the plurality of contact pads on thepatterned doped p-type poly- silicon layer; forming a gold layer on thecircuit layer and on the plurality of contact pads on the patterneddoped p-type poly-silicon layer so as to connect the circuit layer tothe plurality of contact pads; attaching a chip to the plurality of chippads of the circuit layer by using a flip-chip bonding technology,wherein the antenna is electrically coupled to the chip; forming aplurality of through holes on the at least one probe pad; and securelyand correspondingly attaching a plurality of stimulation probes into theplurality of through holes.
 19. The method of claim 18, wherein the stepof forming a circuit layer on the second silicon oxide layer comprisessteps of: sequentially forming a chrome layer and a nickel layer on thesecond silicon oxide layer; and patterning the chrome layer and thenickel layer to form the circuit layer.
 20. The method of claim 18,wherein the step of forming a circuit layer on the second silicon oxidelayer comprises steps of: forming a patterned photoresist layer on thesecond silicon oxide layer; sequentially forming a chrome layer and anickel layer on the patterned photoresist layer; and lifting off thepatterned photoresist layer.
 21. The method of claim 18, wherein thefirst and second silicon oxide layers have a thickness in a range offrom 1 to 10 micrometers.
 22. The method of claim 18, wherein thepatterned doped p-type poly-silicon layer is of a thickness in a rangeof from 10 to 250 micrometers.
 23. The method of claim 18, wherein thegold layer is of a thickness in a range of from 0.01 to 0.5 micrometers.24. The method of claim 18, wherein the flexible substrate furthercomprises a plurality of holes disposed adjacent to four corners thereofallowing a rope passing therethrough for retention.